The cost-reducing wafer dicing and thinning technology achieves significant efficiency by fully automating the transfer between each process: laser processing, wafer separation, rough and fine grinding after crystal separation. Processing time is greatly reduced, eliminating the need for the lapping process, resulting in a 50% increase in yield.
Single-sided CMP (Chemical Mechanical Polishing) equipment for wafers, featuring a unique work disc micro-adjustment function in the industry to ensure excellent finishing quality.
Single side polishing equipment, design for multi and large size wafer process, with spindle independent control and process increasing processing efficiency and quality significantly
Auto Single Side Polishing System for processing larger-size sapphire wafer, providing automatic polishing equipment with load on load function with auto stage transfer, easy use with process ontrolled by PLC, high quality, fast speed, low cost
Adopt special shaft design, high efficiency, fast output,Suitable for double-sided grinding and double-sided polishing products, equipment specifications can be customized; currently provide 24", 28", 32", 36" and other specifications
Possess excellent rigidity and unique rigid structure to improve grinding stability and faster cutting speed, especially for large size with multi wafer thinning process; user-friendly interface makes the operation more convenient
Exclusive wafer thinning process grinding equipment, with high precision and rapid thinning capabilities. Wafer size wide applicability, for 2-inch and 4-inch process, and in accordance with the changing needs polishing process parameters to improve process stability and product quality
Automation waxing way, good quality, effectively improve the efficiency of waxing
Aiming at the GaAs/SiC/Si/Sapphire wafer double-chip bonding process, a fully automatic bonding equipment has been developed and manufactured. In the industry, there is a Robot transmission system, the bonding speed is the fastest, and the bonding quality is stable. Wafer bonding equipment. The operation is very simple, and the thickness is uniform after bonding.
High precision, fast speed, low cost of consumables, and a significant drop in personnel costs.
