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Single-sided CMP (Chemical Mechanical Polishing) equipment for wafers, featuring a unique work disc micro-adjustment function in the industry to ensure excellent finishing quality.
．The working axes have independent motors to increase the stability of the process
．Pneumatic cylinder pressurization, multi-stage pressure setting
．Disk cooling system to increase process quality
．PLC program control support plant monitoring (CIM)
．Multiple protection mechanism and disk monitoring system
．Applicable to various sizes and various wafer processes
．The working axis can be moved to improve the life of the pad
| SiC | GaN | GaAs | Silicon | Sapphire |
| ｖ | ｖ | ｖ | ｖ | ｖ |
| Please contact us for further information, as it can be applied to various materials | ||||
| 2″ | 4″ | 6″ |
| v | v | v |