The cost-reducing wafer dicing and thinning technology achieves significant efficiency by fully automating the transfer between each process: laser processing, wafer separation, rough and fine grinding after crystal separation. Processing time is greatly reduced, eliminating the need for the lapping process, resulting in a 50% increase in yield.
Provide abrasives, grinding tools, abrasives and manufacture other borides, which are widely used in optoelectronics, machinery, electronics,
Instrumentation, chemical industry, metallurgy, national defense, aviation technology, nuclear industry, etc.
Provide polishing of crystal and steel; precision polishing of ceramics and special steel; consolidated and abrasive-resistant tools, cutting, free grinding and polishing;
And it can manufacture advanced refractory materials, engineering ceramics, heating elements and thermal energy elements, etc.
For Wire Sawing and Diamond Wire Cutting Process, effectively extend the life time of diamond wire, and make simultaneous machining a plurality of crystal bar while maintaining performance
Use of nanoscale abrasive particles and a special substrate preparation, a unique complex that tiny particles, low abrasive content of suspended excellent, high purity, fine grain size, no special cleaning process
Chemical mechanical polishing (CMP) using a variety of polishing applications for surface selection diversity (such as flat, lattice, etc.); with CMP polishing liquid, which allows machining surface roughness better meet the market demand for high standards
The carrier for carrying the workpiece, the raw material is high-purity alumina sintered into flakes
Not easy to break, excellent flatness/planarity, surface roughness can be made according to customer requirements
Crafted from carefully selected diamonds for resurfacing polishing discs for smoothing and grooves
Widely used in semiconductor materials, sapphire, diamond, ceramics and other surface treatment
