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The cost-reducing wafer dicing and thinning technology achieves significant efficiency by fully automating the transfer between each process: laser processing, wafer separation, rough and fine grinding after crystal separation. Processing time is greatly reduced, eliminating the need for the lapping process, resulting in a 50% increase in yield.
．Fully automatic silicon carbide ingot input and round output system (robot/laser/splitting/grinding machine)
．Robot arm picks up the silicon carbide ingot from the input tray and places it on the laser cutting table
．Laser cuts the ingot into thin wafers
．Splitting machine splits the wafers into individual pieces
．Grinding machine grinds the surface of the pieces to a smooth finish
| SiC |
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| 4″ | 6″ | 8″ |
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