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Single side polishing equipment, design for multi and large size wafer process, with spindle independent control and process increasing processing efficiency and quality significantly
．High machining accuracy (finished thickness <±2μ)
．Applicable to "Copper Plate" and "Polishing Pad"
．Automatic disc trimming system
．Temperature controlled cooling system
．Diamond liquid spraying system
．Pneumatic cylinder can automatically lift
| SiC | GaN | GaAs | Silicon | Sapphire |
| ｖ | ｖ | ｖ | ｖ | ｖ |
| Please contact us for further information, as it can be applied to various materials | ||||
| 2″ | 4″ | 6″ |
| v | v | v |