OEM service
Foundry Process
GALAXY Technology offers a full range of wafer dicing, free lapping and precision polishing technologies. Rich wafer thinning technology, to establish a complementary and balanced diversified product line To serve customers with competitive cost and quality.
The materials that can be processed by epitaxial wafer are: SiC, GaN, silicon, sapphire, quartz, glass, ceramics, etc.
客戶需求
樣品分析
評估樣品
樣品試做
樣品確認
報價
正式量產
Wafer Dicing Knife Heavy Industry
Preliminarily teach clients visual inspection for wafer dicing knives (hard knives), with professional technology of recycled knives and ISO quality assurance system.
Realizing that the cutting knives that have been used once can be used again,
it will save more costs for customers, and through the quality assurance system,
it will effectively check for customers, so that customers can use recycled knives with more confidence