Process Materials

30"、32"、36"、48"、50",Customization Available

Unique resin and metal sintering plate and applying with Slurries for various wafer polishing or lapping process

GDS            系列

Apply for Dressing the Diamond wheel before Grinding process

255系列、305系列      可客製化

Special sintering diamond wheel for sapphire or wafers substrate thinning process, best grinding efficiency, dressing free with continuous high cutting capability, plus long life time

ETL              系列

It exhibits a liquid state at room temperature and solidifies upon heating and cooling; suitable for sapphire substrate processing and used in conjunction with a spin coater

GTL-A Series

Using solid wax adhesion on carrier to assist the smooth grinding process