Possess excellent rigidity and unique rigid structure to improve grinding stability and faster cutting speed, especially for large size with multi wafer thinning process; user-friendly interface makes the operation more convenient

Exclusive wafer thinning process grinding equipment, with high precision and rapid thinning capabilities. Wafer size wide applicability, for 2-inch and 4-inch process, and in accordance with the changing needs polishing process parameters to improve process stability and product quality