Automation waxing way, good quality, effectively improve the efficiency of waxing

Aiming at the GaAs/SiC/Si/Sapphire wafer double-chip bonding process, a fully automatic bonding equipment has been developed and manufactured. In the industry, there is a Robot transmission system, the bonding speed is the fastest, and the bonding quality is stable. Wafer bonding equipment. The operation is very simple, and the thickness is uniform after bonding.
High precision, fast speed, low cost of consumables, and a significant drop in personnel costs.