Apply for Dressing the Diamond wheel before Grinding process

Special sintering diamond wheel for sapphire or wafers substrate thinning process, best grinding efficiency, dressing free with continuous high cutting capability, plus long life time

It exhibits a liquid state at room temperature and solidifies upon heating and cooling; suitable for sapphire substrate processing and used in conjunction with a spin coater

Using solid wax adhesion on carrier to assist the smooth grinding process

Apply with polishing plate

Use for diamond wire manufacturing

Various types of wafer hard polishing