Single side polishing equipment, design for multi and large size wafer process, with spindle independent control and process increasing processing efficiency and quality significantly
Auto Single Side Polishing System for processing larger-size sapphire wafer, providing automatic polishing equipment with load on load function with auto stage transfer, easy use with process ontrolled by PLC, high quality, fast speed, low cost
Adopt special shaft design, high efficiency, fast output,Suitable for double-sided grinding and double-sided polishing products, equipment specifications can be customized; currently provide 24", 28", 32", 36" and other specifications
