Wafer Cutting Fluid GTC-SWC-2500、GTC-SWC-6000

Description

For Wire Sawing and Diamond Wire Cutting Process, effectively extend the life time of diamond wire, and make simultaneous machining a plurality of crystal bar while maintaining performance

Feature

Processing chip and cooling effect to help and make the finished product has a good surface roughness and TTV
Unique formula is biodegradable
Cleanable with water, harmless to the environment

Application

Applicable to a variety of different materials. If you need more detailed information, please contact us.

Dimension

N/A