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Widely used in semiconductor materials, sapphire, diamond, ceramics and other surface treatment
Good self-sharpening
Diamond Technology edge passivation, effectively prevent scratches on the workpiece surface depth
Rigorous grading, precise allocation granularity
Unique irregular crystal structure that can withstand greater pressure
Multi-angle cutting surface, can provide a high removal rate
Applicable to a variety of different materials. If you need more detailed information, please contact us.
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