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Auto Single Side Polishing System for processing larger-size sapphire wafer, providing automatic polishing equipment with load on load function with auto stage transfer, easy use with process ontrolled by PLC, high quality, fast speed, low cost
．Suitable for various processes and capable of processing 4" and 6" sapphire wafers
．Automatic arm handling function for achieving fully automated continuous production
．Automatic measurement of workpiece thickness during the processing
．Improved stability and product quality in the polishing process
．Work axis swing function to expand the surface area utilization and reduce production costs
．Automatic grooving system for the polishing disc to extend its lifespan and reduce production costs
．Polishing disc angle control system for creating grooves and adjusting the polishing angle
．Equipped with automatic cleaning function to maintain a clean environment
．Applicable protective mechanisms to prevent losses caused by human negligence
．Simple operation and easy maintenance
| SiC | GaN | GaAs | Silicon | Sapphire |
| ｖ | ｖ | ｖ | ｖ | ｖ |
| Please contact us for further information, as it can be applied to various materials | ||||
| 2″ | 4″ | 6″ |
| v | v | v |