CMP拋光墊 提供多樣性的表面選擇

Description

Chemical mechanical polishing (CMP) using a variety of polishing applications for surface selection diversity (such as flat, lattice, etc.); with CMP polishing liquid, which allows machining surface roughness better meet the market demand for high standards

Feature

Surface and bottom special composite material structure
High polish removal rate and long life
Diversified gasket materials to meet various needs

Application

Applicable to a variety of different materials. If you need more detailed information, please contact us.

Dimension

N/A