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Adopt special shaft design, high efficiency, fast output,Suitable for double-sided grinding and double-sided polishing products, equipment specifications can be customized; currently provide 24", 28", 32", 36" and other specifications
．PLC interface, ease to operate
．Suit for all kind of wafers size, good thickness uniformity
．Gantry design for better structural rigidity
．Multi-stage compression settings
．Multi-directional operation, the center gear can be positive or reversed for all kinds of product processing
．Auto Thickness Measurement Function Possible
| SiC | GaN | GaAs | Silicon | Sapphire |
| ｖ | ｖ | ｖ | ｖ | ｖ |
| Please contact us for further information, as it can be applied to various materials | ||||
| 2″ | 4″ | 6″ |
| v | v | v |