Menu
Menu
Possess excellent rigidity and unique rigid structure to improve grinding stability and faster cutting speed, especially for large size with multi wafer thinning process; user-friendly interface makes the operation more convenient
．Finished thickness can be set
．Machining process data statistics (SPC) archiving
．Automatic measurement of finished thickness
．Automatic grinding wheel dressing design
．Multiple protection design
．Window operating system, great data compatibility
．Simple operation and easy maintenance
| SiC | GaN | GaAs | Silicon | Sapphire |
| ｖ | ｖ | ｖ | ｖ | ｖ |
| Please contact us for further information, as it can be applied to various materials | ||||
| 2″ | 4″ | 6″ | 8″ |
| v | v | v | v |