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Exclusive wafer thinning process grinding equipment, with high precision and rapid thinning capabilities. Wafer size wide applicability, for 2-inch and 4-inch process, and in accordance with the changing needs polishing process parameters to improve process stability and product quality
．Dresser is equipped with axes, automatic wheel dressing
．According to different processes, grinding parameters automatically transform
．Data storage capability for processing data, facilitating easy management
．Built-in auto-detection feature diamond grinding wheel thickness
| SiC | GaN | GaAs | Silicon | Sapphire |
| ｖ | ｖ | ｖ | ｖ | ｖ |
| Please contact us for further information, as it can be applied to various materials | ||||
| 2″ | 4″ | 6″ |
| v | v | v |