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Special sintering diamond wheel for sapphire or wafers substrate thinning process, best grinding efficiency, dressing free with continuous high cutting capability, plus long life time
．Excellent grinding efficiency
．Good wear resistance, improved accuracy and finished wheel life time
．Only with water cooling, reduce costs and shorten maintenance time
．Diamond Chip Wear stability without wheel dressing
| SiC | GaN | GaAs | Silicon | Sapphire |
| ｖ | ｖ | ｖ | ｖ | ｖ |
| Please contact us for further information, as it can be applied to various materials | ||||
| 2″ | 4″ | 6″ | 8″ |
| V | V | V | V |