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Aiming at the GaAs/SiC/Si/Sapphire wafer double-chip bonding process, a fully automatic bonding equipment has been developed and manufactured. In the industry, there is a Robot transmission system, the bonding speed is the fastest, and the bonding quality is stable. Wafer bonding equipment. The operation is very simple, and the thickness is uniform after bonding.
High precision, fast speed, low cost of consumables, and a significant drop in personnel costs.
．Robot delivery system
．The equipment can be manually operated to correct the arm position, without the need for a robot calibrator
．Cassette In & Cassette Out Operation Mode
．Single coating or double coating function can be set
．Independently use mechanical method for wafer centering correction
．Independently use CCD image recognition to find flat edge or Notch
．Multi-stage preheating parameter adjustment
．Multi-stage SPIN parameter adjustment
．Vacuum method for double-piece positioning and lamination
．Replace the plastic barrel, replenish the lotion, and replace the waste liquid barrel by pulling the platform
．Window operating system, great data compatibility
．SECS/GEM function
| SiC | GaN | GaAs | Silicon | Sapphire |
| ｖ | ｖ | ｖ | ｖ | ｖ |
| Please contact us for further information, as it can be applied to various materials | ||||
| 6″ |
| ｖ |