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This product is specifically designed to reduce by-products generated during semiconductor manufacturing. Its core employs an innovative planar heating technology, utilizing a conductive network composed of carbon nanotubes (CNTs) and graphene nanosheets (GNPs) to generate heat. Through only 100μmThe ultra-thin nano-carbon membrane provides faster and more precise temperature control than traditional wire heating jackets, effectively preventing exhaust gas from condensing at flanges or bends. 。
High-efficiency heating mechanism：Using CNTs as bridges to connect GNP particles, a uniform planar heating effect is generated through electron collisions. 。
Excellent temperature control：It has a low coefficient of thermal expansion, and can withstand temperatures up to [temperature value missing]. 230°C In less than 30 minutes 。
Durability and stability：The thin film possesses good elasticity and maintains stable physical properties even under high power supply. 。
Energy saving and design advantages：Compared to metal etching, nano-carbon films perform better in small pattern designs and high-voltage environments, and have lower power consumption (80~100W). 。
Wide operating temperature range：Recommended temperature range: 200°C，The highest extreme temperature can reach 250°C。
Semiconductor process area：LP CVD equipment at the FAB and Sub-FAB ends 。
Piping system：Chamber to Pump section, exhaust line. 。
Washing equipment：Inlet and outlet pipelines from the pump to the POU scrubber. 。
Powder processing systemPowder Moving System (PMS) Back End and Hot Nitrogen (Hot N2）Piping 。
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