CMP 拋光液 CMP60、CMP160等

Description

Use of nanoscale abrasive particles and a special substrate preparation, a unique complex that tiny particles, low abrasive content of suspended excellent, high purity, fine grain size, no special cleaning process

Feature

Special polycrystalline alumina structure can effectively control the polishing temperature
High removal rate with excellent surface roughness for an excellent finished surface
Easy to clean, no crystal residue
Reusable and recyclable, reducing processing and cost

Application

Applicable to a variety of different materials. If you need more detailed information, please contact us.

Dimension

N/A