Chemical mechanical polishing (CMP) using a variety of polishing applications for surface selection diversity (such as flat, lattice, etc.); with CMP polishing liquid, which allows machining surface roughness better meet the market demand for high standards
Surface and bottom special composite material structure
High polish removal rate and long life
Diversified gasket materials to meet various needs
Applicable to a variety of different materials. If you need more detailed information, please contact us.
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